Associate Professor, Mechanical Engineering

Courtesy Appointments, Civil and Environmental Engineering, Materials Science and Engineering

Rahul Panat

Source: College of Engineering


Carnegie Mellon University
Mechanical Engineering
5000 Forbes Avenue
Scaife Hall 316
Pittsburgh, PA 15213

Phone: 412-268-2501

Fax: 412-268-3348




Rahul Panat is an Associate Professor of Mechanical Engineering at the Carnegie Mellon University (CMU). He received his MS in mechanical engineering from the University of Massachusetts, Amherst, and PhD in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign (UIUC). 

After his PhD, Dr. Panat worked at Intel Corporation, Chandler, AZ, for a decade in the area of microprocessor manufacturing R&D (2004-2014). His work at Intel included research on next generation high density interconnects, thinning of Si, 3-D packaging, lead free, and halogen free ICs. He also worked on embedded passives for ultra-high-performance microprocessors. He won several awards for his work at Intel, including an award for developing manufacturing processes for world’s first fully green IC chip in 2007. From 2012-2014, he was an adjunct faculty at the Arizona State University and worked in the area of Li-ion batteries. He moved to academics in 2014 and joined the Washington State University, Pullman, to start working in the areas of additive manufacturing and printed/flexible electronics before moving to CMU in 2017. 


Research in Panat lab is focused on using the knowledge of material behavior and mechanics to design novel manufacturing methods for various applications. The research has three primary thrust areas, namely, microscale additive manufacturing, flexible and printed microelectronics, and advanced energy materials. The research aims to enhance the fundamental scientific knowledge and create engineering breakthroughs in several important applications. Research will enable ‘designer’ materials that can have unusual mechanical properties such as high strength but ultra-low weight and are highly desirable for structural applications. The research will also help realize high performance high temperature sensors and improved energy storage solutions. Lastly, the research will help enable low-cost wearable devices such as bio-patches and robotic skin.

Several fundamental problems are being addressed in Panat lab in order to enable critical technologies and applications. We recently mimicked the natural process of the formation of ‘Desert Roses’ in Namibian desert to develop a breakthrough additive manufacturing method that can make 3-D hierarchical materials with structural control from hundreds of nanometers to several millimeters! This method helps fabricate strain tolerant and fast charging Li-ion batteries and topologically optimized materials. We also used the concept of periodic bonding of a metal sheet to polymer substrate in order to confine the deformation of the metal sheet to narrow bands, thus reducing the gauge length to scales lower than that required for the deformation processes involved in plastic instability. This resulted in the first demonstration of stretching of a metal sheet to double its original length without failure; a breakthrough that will enable stretchable interconnects for wearable electronics.

To understand the effect of manufacturing processes on the mechanical and electrical properties of the structures, we use several material characterization techniques such as SEM, TEM, EDX, impedance spectroscopy, and XRD. These insights, in turn, lead to methods that can be used to tailor materials with desired properties. We also use several advanced manufacturing methods such as Aerosol Jet based 3D printing, photonic sintering, and atmospheric plasma etch etc. Currently, Panat lab is looking to hire several PhD students to work in these areas of research.



Selected Publications

See complete publication list on Google Scholar.

  • M. Sadeq Saleh, J. Li, J. Park, and R. Panat, “3D printed hierarchically-porous microlattice electrode materials for exceptionally high specific capacity and areal capacity lithium ion batteries”, Additive Manufacturing, Vol. 23, 70-78 (2018).
  • MT Rahman, R Moser, HM Zbib, CV Ramana, and R Panat, “3D printed high performance strain sensors for high temperature applications”, JAP, Vol. 123 (2), 024501 (2018).
  • M. Sadeq Saleh, C. Hu, and R. Panat, “Three dimensional micro-architected materials and devices using nanoparticle assembly by pointwise spatial printing”, Science Advances, 3, e1601986 (2017).
  • H. Yang, M. T. Rahman, D. Du, R. Panat, and Y. Lin, “3-D printed adjustable microelectrode arrays for electrochemical sensing and biosensing”, Sensors and Actuators B: Chemical, Vol. 230, 600-606 (2016).
  • Y. Arafat, I. Dutta, R. Panat, “Super-stretchable metallic interconnects on polymer with a linear strain of up to 100%” Applied Physics Letters, 107, 081906 (2015).
  • R. Panat, “A model for crack initiation in the Li-ion battery electrodes”, Thin Solid Films, Vol. 596, pp. 174-178 (2015).


BS, Mechanical Engineering, Pune University, India, 1997
MS, Mechanical Engineering, University of Massachusetts, Amherst, 1999
PhD, Theoretical and Applied Mechanics, University of Illinois, Urbana, 2004

Related News 

3D-printed lithium-ion battery could power electric vehicles, drones, 

3 ways Pittsburgh is steering a course toward a future of renewable energy, NEXTpittsburgh 

See how this bew 3D printing method could make your smartphone last longer, Forbes 

3D-printed batteries could mean lightweight, longer-lasting electronics,

Aerosol 3D printing of battery electrodes 

3D printing the next generation of batteries 

New 3D printing method for more sensitive strain gauges 

ED printing put to use to create more senstitive strain gauges for high-temperature application

Carnegie Mellon explores 3D micro-additive manufacturing with Optomec System

New 3D printing method for more sensitive strain gauges

Carnegie Mellon University deploys Optomec’s Aerosol Jet Technology

3-D printing remakes the strain gauge

3-D printing doubles the strength of stainless steel 

A driving force in the 3-D printing world 

Novel 3D printing method goes up and down the scale  

Huge Nanostructures (in German)

Researchers create super-stretchable metallic conductors for flexible electronics 


Recognition and Honors

MRS Gold Medal, 2002
Recognition award at Intel Corporation for developing manufacturing processes for first fully ‘green’ IC chip, 2007