K. Jimmy Hsia

Vice Provost for International Programs and Strategy; Professor, Mechanical Engineering & Biomedical Engineering

Jimmy Hsia

Source: College of Engineering


Carnegie Mellon University
5000 Forbes Avenue
Pittsburgh, PA 15213-3890

Phone: 412-268-5961

Fax: 412-268-2330

Email: kjhsia@cmu.edu


K. Jimmy Hsia is Vice Provost for International Programs and Strategy, and Professor of Mechanical Engineering and Biomedical Engineering at Carnegie Mellon University. He received his B.S. from Tsinghua University, Beijing, China, and his Ph.D. from MIT. His research interests include deformation and failure mechanisms of materials, micro/nanomechanics of nanoscale materials, and cell mechanics. He is a Fellow of American Association for the Advancement of Science (AAAS), a Fellow of American Society of Mechanical Engineers (ASME), and recipient of NSF Research Initiation Award, Max-Planck Society Scholarship, Japan Society for Promotion of Science Fellowship. Before joining CMU in 2015, he was W. Grafton and Lillian B. Wilkins Professor of Mechanical Science and Engineering at the University of Illinois at Urbana-Champaign (UIUC). From 2005-2007, Hsia served as Founding Director of Nano and Bio Mechanics Program in the Directorate for Engineering at NSF. He served as Associate Dean of Graduate College and Associate Vice Chancellor for Research for New Initiatives at UIUC. He is a co-Editor-in-Chief of a newly launched Elsevier journal, Extreme Mechanics Letters, whose announcement on iMechanica attracted more 10,000 hits within a week.

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B.S. (Engineering Mechanics) 1982 Tsinghua University                                      

M.S. (Mechanical Engineering) 1984 Beijing Inst. Aeronautics                               

Ph.D. (Mechanical Engineering) 1990 MIT                                                               

Postdoc (Mechanics and Materials11/89-07/91 MIT                


Cell mechanics and bionanotechnology

Nanotechnology for biosensing and bioactuation

Mismatch strain or capillary induced self-assembly of 3D structures and devices

Electro-mechanical coupling of carbon nanotubes and nanotube composites

Surface morphology evolution of thin film structures at high temperatures

Nanoscale features and their effects on mechanical behavior in biological materials

Domain switching and phase transition in piezoelectric and ferroelectric materials

Accelerated fatigue testing method using piezoelectric actuators

Micro and nano-mechanics on mechanisms of deformation and fracture

Dislocation mechanics and brittle-to-ductile transition

Fluid-solid interaction problems

Selected Journal Publications

  • Eric Epstein, Jaewon Yoon, Amit Madhukar, K. Jimmy Hsia, and Paul V. Braun, “Colloidal Particles that Rapidly Change Shape via Elastic Instabilities”, Small, 2015, in press

  • Michael J. Motala, Daniel Perlitz, Christopher M. Daly, Peixi Yuan, Ralph G. Nuzzo, and K. Jimmy Hsia, “Programming Matter through Strain”, Extreme Mechanics Letts, 3, pp 8-16, 2015.

  • Jinyun Liu, Nan Li, Matthew D. Goodman, Hui Gang Zhang, Eric S. Epstein, Bo Huang, Zeng Pan, Jinwoo Kim, Junhee Choi, Xingjiu Huang, Jinhuai Liu, K. Jimmy Hsia, Shen J. Dillon & Paul V. Braun, “Mechanically and chemically robust sandwich-structured C@Si@C nanotube array Li-ion battery anodes”, ACS Nano, 9 (2), pp 1985–1994, 2015.

  • Wen Huang, Seid Koric, Xin Yu, K. Jimmy Hsia, and Xiuling Li, “Precision structural engineering of self-rolled-up 3Dnanomembranes guided by transient quasi-static FEM modeling”, Nano Letts, 14 (11), pp 6293–6297, 2014.

  • Michael S. Grigola, Casey L. Dyck, Derin S. Babacan, Danielle N. Joaquin, K. Jimmy Hsia, “Myoblast alignment on 2D wavy patterns: dependence on feature size and cell-cell interaction”, Biotechnology and Bioengineering, 111(8), 1617-1626, 2014.

  • Amit Madhukar, Daniel Perlitz, Michael Grigola, Donghai Gai, K. Jimmy Hsia, “Bistable characteristics of axisymmetric dome”, International Journal of Solids and Structures, 51(14), 2590-2597, 2014.

  • Paul Froeter, Xin Yu, Wen Huang, Frank Du, Moyang Li, Ik Su Chun, Seung Hyun Kim, K. Jimmy Hsia, John A. Rogers, and Xiuling Li, "3D hierarchical architectures based on self-rolled-up silicon nitride membranes", Nanotechnology 24 (2013) 475301. 

  • Liu QJ, FN Zhang, DM Zhang, N Hu, H Wang, KJ Hsia, P Wang, “Bioelectronic tongue of taste buds on microelectrode array for salt sensing”, Biosensors & Bioelectronics, 40(1), 115-120, 2013.

  • Liu QJ, H Wang, HL Li, J Zhang, SL Zhuang, FN Zhang, KJ Hsia, P Wang, “Impedance sensing and molecular modeling of an olfactory biosensor based on chemosensory proteins of honeybee”, Biosensores & Bioelectronics, 40(1), 174-179, 2013.

  • Liu QJ, N Hu, FN Zhang, DM Zhang, KJ Hsia, P Wang, “Olfactory epithelium biosensor: odor discrimination of receptor neurons from a bio-hybrid sensing system”, Biomedical Microdevices, 14(6), 1055-1061, 2012.

  • Huang X, H Yang, ACT van Duin, KJ Hsia, SL Zhang, “Chemomechanics control of tearing paths in grapheme”, Physical Review B, 85(19), Art No. 195453, 2012.

  • Liu QJ, FN Zhang, N Hu, H Wang, KJ Hsia, P Wang, “Microelectrode Recording of Tissue Neural Oscillations for a Bionic Olfactory Biosensor”, Journal of Bionic Engineering, 9(4), 494-500, 2012.

  • Alizadegan R, A. D. Liao, F. Xiong, E. Pop, and K. J. Hsia, “Effects of Tip–Nanotube Interactions on Atomic Force Microscopy Imaging of Carbon Nanotubes”, Nano Research, 5(4), 235-247, 2012 (cover article).

  • Jeong  JH, V. Chan, C. Cha, P. Zorlutuna, C. Dyck, K. J. Hsia, R. Bashir, and H. Kong, “’Living’ Microvascular Stamp for Patterning of Functional Neovessels; Orchestrated Control of Matrix Property and Geometry”, Adv Mater, 24, 58-63, 2012 (cover article).

  • Millet, L.J., K. Park, N. N. Watkins, K. J. Hsia, R. Bashir, “Separating Beads and Cells in Multi-channel Microfluidic Devices Using Dielectrophoresis and Laminar Flow”, Journal of Visualized Experiments (JoVE) - Bioengineering, issue 48, 02/04/11, 2011.

  • Bashir R, M.L. Gillette, K.J. Hsia, T.A. Saif, M. Sheetz, L.A. Miller, “NSF IGERT at UIUC: Training the Next Generation of Leaders in Cellular and Molecular Mechanics and BioNanotechnology (CMMB IGERT)”, Molecular Biology of the Cell, 22, 2011.

  • Liu W, L. Zhang, K. J. Hsia, J.J. Shang, “Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern”, J Mater Sci and Tech, 26(12), 1143-1147, 2010.

  • Park, K., L. Millet, N. Kim, H. Li, X. Jin, G. Popescu, N.R. Aluru, K. J. Hsia, R. Bashir, "Measurement of Adherent Cell Mass and Growth", PNAS, 107:48, 20691-20696, 2010.

  • Chun I.S, A. Chall, B. Derickson, K. J. Hsia, X. Li, “Geometry Effect on the Strain-Induced Self-Rolling of Semiconductor Membranes”, Nano Letts, 10, 3927-3932, 2010.

  • Liao A., R. Alizadegan, Z.-Y. Ong, S. Dutta, F. Xiong, K. J. Hsia, E. Pop, “Thermal Dissipation and Variability in Electrical Breakdown of Carbon Nanotube Devices”, Physical Review B, 82, 205406, 2010. Selected to be published in Virtual Journal of Nanoscale Science & Technology, Vol 22, Issue 21, 2010.

  • Li H., X. Guo, R. G. Nuzzo, K. J. Hsia, “Capillary Induced Self-Assembly of Thin Foils into 3D Structures”, Journal of the Mechanics and Physics of Solids, 58, 2033-2042, 2010.

  • Samuel J , SG Kapoor,  RE DeVor,  KJ Hsia, “Effect of Microstructural Parameters on the Machinability of Aligned Carbon Nanotube Composites”, J. Manufacturing Sci & Engineering-Trans of the ASME,  132( 5), Art no. 051012:1-9, 2010.

  • Huang, X., H. Yuan, K. J. Hsia, and S. Zhang, "Coordinated Buckling of Thick Multi-Walled Carbon Nanotubes Under Uniaxial Compression,” Nano Research, 3, 32, 2010.

  • Kamm R.D., R. Nerem, K. J. Hsia, “Cells into Systems: A new research center will work with the basics of life to build complex biological machines”, Mechanical Engineering Magazine, Vol. 132 (11), 30-34, 2010.

  • Guo, X., H. Li, B.Y. Ahn, E. B. Duoss, K. J. Hsia, J. A. Lewis, R. G. Nuzzo, “Two and Three-Dimensional Folding of Thin Film Single-Crystalline Silicon for Photovoltaic Power Applications”, PNAS 106:20149-20154 (featured cover article), 2009.

  • Hsia, K. J., "Role of Mechanics in Biological Materials Research," 2009 McGraw-Hill Yearbook of Science & Technology, McGraw-Hill, New York, pp. 319-326, 2009 (invited).

  • Alizadegan, R., K. J. Hsia and T. J. Martinez, “A Divide and Conquer Real Space Finite-Element Hartree-Fock Method”, Journal of Chemical Physics, 132(3), Art No. 034101, 2008.

  • Samuel, J., A. Dikshit, R. E. DeVor, S. G. Kapoor, and K. J. Hsia, “Effect of Carbon Nanotube (CNT) Loading on the Thermo-mechanical Properties and the Machinability of CNT-Reinforced Polymer Composites,” ASMEJournal of Manufacturing Science and Engineering, 131(3), Art No. 031008:1-9, 2008.

  • Terdalkar, S. S., S. Zhang, J. J. Rencis, and K. J. Hsia, “Molecular Dynamics Simulations of Ion-irradiation Induced Deflection of 2D Graphene Films,” International Journal of Solids and Structures, 45:13, 3908-3917, 2008.

  • Samuel, J., R. E. DeVor, S. G. Kapoor, and K. J. Hsia, ”Experimental Investigation of the Machinability of Polycarbonate Reinforced with Multiwalled Carbon Nanotubes,” Journal of Manufactruing Science and Engineering, Transactions of the ASME, 128:2, 465-473, 2006.

  • Hsia, K. J., M. Goken, T. Pollock, and P. D. Progella, “TMS Honorary Symposium for Hael Mughrabi,” Advanced Engineering Materials, 9:7, 525-525, 2007.

  • Zhang, S., R. Khare, T. Belytschko, K. J. Hsia, S. L. Mielke, and G. C. Schatz, “Transition States and Minimum Energy Pathways for the Collapse of Carbon Nanotubes,” Physical Review B, 73, 075423:1-7, 2006.

  • Huang, Y., Zhou, W., Hsia, K. J., Menard, E., Park, J.-U., Rogers, J., and Alleyne, A. G., "Stamp collapse in soft lithography," Langmuir, 21, 8058-8068, 2005.

  • Hsia, K. J., Huang, Y., Menard, E., Park, J.-U., Zhou, W., Rogers, J., and Fulton, J. M., "Collapse of microcontact printing stamps due to interfacial adhesion," Applied Physics Letters, 86, 154106:1-3 (2005). Selected to be published in Virtual Journal of Nanoscale Science & Technology, Issue April 18, 2005.

  • Liu, M., Hsia, K. J., Shang, J.-K., "Driving forces for interfacial fatigue crack growth by piezoelectric actuators," Journal of intelligent material systems and structures, 16:7/8, 557-566, 2005.

  • Panat, R., Hsia, K. J., and Cahill, D. G., "Evolution of surface waviness in thin films via volume and surface diffusion," Journal of Applied Physics, 97, 013521:1-7 (2005)

  • Liu, M., Hsia, K. J. and Sardela, M., "In-situ X-ray diffraction study of electric field induced domain switching and phase transition in PZT-5H", Journal of American Ceramic Society, 88(1), 210-215 (2005).

  • Panat, R., Hsia, K. J., and Oldham, J., "Rumpling instability in thermal barrier systems under isothermal conditions in vacuum," Philosophical Magazine, 85(1), 45-64 (2005).

  • Ji, B., Gao, H., and Hsia, K. J., "How do slender mineral crystals resist buckling in biological materials," Philosophical Magazine Letters, 84(10), 631-641 (2004).

  • Thiagarajan, G., Huang, Y., and Hsia, K. J., "Fracture simulation using an elasto-viscoplastic virtual internal bond model with finite elements," ASME Journal. of Applied  Mechanics, 71, 796-804 (2004).

  • Panat, R. and Hsia, K. J.,"Experimental investigation of the bond coat rumpling instability under isothermal and cyclic thermal histories in thermal barrier systems," Proc. Royal Soc  London, Series A, 460, 1957-1979 (2004).

  • Thiagarajan G, Hsia KJ, and Huang Y, "Finite element implementation of virtual internal bond model for simulating crack behavior", Engineering Fracture Mechanics, 71(3), 401-423 (2004).

  • Liu, M. and Hsia, K. J., "Locking of electric field induced non-180° domain switching and phase transition in ferroelectric materials upon cyclic electric fatigue," Applied Physics Letters, 83 (19), 3978-3980 (2003).

  • Zhang, S., Panat, R., and Hsia, K. J., "Influence of surface morphology on the adhesive strength of aluminum/epoxy interfaces", J. of Adhesion Science and Technology, 17 (12), 1685-1711 (2003).

  • Zhang, S., Johnson, H. T., Wagner, G. J., Liu, W. K., and Hsia, K. J., “Stress generation mechanisms in carbon thin films grown by ion-beam deposition”, Acta Materialia51 (17), 5211-5222 (2003).

  • Liu, M. and Hsia, K. J., "Interfacial cracks between piezoelectric and elastic materials under in-plane electric loading", Journal of the Mechanics and Physics of Solids, 51, 921-944 (2003).

  • Wang, W., Huang, Y., Hsia, K. J., Hu K. X., Yeh C. P., and Chandra, A., "Bending of ultra-thin beams by strain gradient plasticity," International Journal of Plasticity, 19, 365-382 (2003).

  • Panat, R., Zhang, S., Hsia., K. J.,"Bond coat surface rumpling in thermal barrier coatings", Acta Materialia, 51, 239-249 (2003).

  • Saif MTA, Zhang S, Haque A, Hsia, KJ, "Effect of the native Al2O3 on the elastic response of nanoscale Al films", Acta Materialia, 50(11), pp. 2779-2786 (2002).

  • Zhang, S., Hsia, K.J., and Pearlstein, A.J., "Potential flow model of cavitation-induced interfacial fracture in a confined ductile layer", Journal of the Mechanics and Physics of Solids, 50, pp. 549-569 (2002).

  • Du, T., Liu, M., Seghi, S., Hsia., K. J., Economy, J. and Shang, J. K., "Piezoelectric actuation of crack growth along polymer-metal interface in adhesive bonds", Journal of Materials Research, 16 (10) 2885-2892 (2001).

  • Busche, M., J.,  Hsia, K. J. , "Fracture and domain switching by indentation in Barium Titanate single crystals", Scripta Materialia44, 207-212 (2001).

  • Zhang S. and Hsia K. J., "Modeling the fracture of a sandwich structure due to cavitation in a ductile adhesive layer", ASME Journal of Applied Mechanics 68, 93-100 (2001).

  • Hsia K. J., Gao, H. and Xin Y., "On the spacing between dislocation nucleation sources at crack tips," Materials Science and Engineering A, 317 (1-2) 257-263 (2001).

  • Ferney BD, DeVary MR, Hsia KJ, and Needleman A, “Oscillatory crack growth in glass.” Scripta Materialia, 41, pp. 275-281 (1999).

  • Ferney BD and Hsia KJ, "The influence of multiple slip systems on the brittle-ductile transition in silicon," Materials Science and EngineeringA272, pp. 422-430 (1999).

  • Xin, Y.-B. and Hsia, K. J., "Simulation of the brittle-to-ductile transition in silicon single crystals using dislocation mechanics," Acta Materialia45, 1747-1759 (1997).

  • Dey, N., Hsia, K. J. and Socie, D. F., "The effects of grain size distribution on cavity nucleation and creep deformation in ceramics containing viscous grain boundary phase," Acta Materialia, 45, 4117-4129 (1997).

  • Hsia, K. J. and Xin, Y.-B., "Discussion on the comment on the simulation of the brittle-ductile transition in silicon single crystals using dislocation mechanics," Scripta Materialia, 37, 1905-1907 (1997).

  • Xu, Z.-Q. and Hsia, K. J., "A numerical solution of surface crack under cyclic hydraulic pressure loading," ASME Journal of Tribology, 119 (4) 637-645 (1997).

  • Hsia, K. J., Dey, N. and Socie, D. F., "High termperature failure mechanisms of ceramics under static and cyclic loading," Advances in Solid Mechanics, S.-W. Yu, W. Yang and Q.-S. Zheng, eds., Tsinghua University Press, 196-203 (1997).

  • Hsia, K. J., Zhang, T.-L. and Socie, D. F., "Effect of crack surface morphology on the fracture behavior under mixed mode loading," Fatigue and Fracture Mechanics: 27th Volume, ASTM STP 1296, R. S. Piascik, J. C. Newman, and N. E. Dowling, Eds., American Society for Testing and Materials, 152-174 (1997).

  • Xin, Y.-B. and Hsia, K. J., "A technique to generate straight through-thickness surface cracks and its application to studying dislocation nucleation in Si," Acta Materialia44, 845-53 (1996).

  • Hsia, K. J. and Xu, Z.-Q., "The mathematical framework and an approximate solution of surface crack propagation under hydraulic pressure loading," International Journal of Fracture, 78, 363-378 (1996).

  • Dey, N., Socie, D. F. and Hsia, K. J., "Tensile creep behavior of a vitreous-bonded aluminum oxide under static and cyclic loading," Journal of the American Ceramic Society, 79 (9) 2353-2363 (1996).

  • Xin, Y.-B., Hsia, K. J. and Lange, D., "Quantitative characterization of the fracture surface of Si single crystals by confocal microscropy," Journal of the American Ceramic Society78, 3201-208 (1995).

  • Hsia, K. J. and Xu, Z., "Effect of hydraulic pressure on surface crack propagation," Acta Mechanica Solida Sinica8, 604-608 (1995).

  • Dey, N., Socie, D. F. and Hsia, K. J., "Modeling static and cyclic fatigue in ceramics containing a viscous grain boundary phase," Acta Metallurgica et Materialia, 43, 2163-2175 (1995).

  • Hsia, K. J. and Argon, A. S., "Experimental study of micromechanisms of brittle-to-ductile transition in Si single crystals," Materials Science and EngineeringA176, 111-119 (1994).

  • Nitzsche, V. R. and Hsia, K. J., "Modeling of dislocation mobility controlled brittle-to-ductile transition," Materials Science and EngineeringA176, 155-164 (1994).

  • Hsia, K. J., Suo, Z. and Yang, W., "Cleavage due to dislocation confinement in layered materials," Journal of Mechanics and Physics of Solids42, 877-896 (1994).

  • Barkey, M. E., Socie, D. F. and Hsia, K. J., "A yield surface approach to the estimation of notch strains for proportional and nonproportional cyclic loading,"  ASME Journal of Engineering Materials and Technology116, 173-180 (1994).

  • Hsia, K .J., Xin, Y.-B. and Lin, L., "Numerical simulation of semi-crystalline nylon 6: elastic constants of crystalline and amorphous parts," Journal of Materials Science29, 1601-1611 (1994).

  • Hsia, K. J., Argon, A. S. and Parks, D. M., "Dominant creep failure process in tensile components," ASME Journal of Engineering Materials and Technology114, 255-264 (1992).

  • Hsia, K. J., Parks, D. M. and Argon, A. S., "Effects of grain boundary sliding in creep-constrained boundary cavitation and creep deformation," Mechanics of Materials11, 43-62 (1991).

  • Hsia, K. J., Argon, A. S. and Parks, D. M., "Modeling of creep damage evolution around blunt notches and sharp cracks,"  Mechanics of Materials 11, 19-42 (1991).

  • Brede, M., Hsia, K. J. and Argon, A. S., "Brittle crack propagation in silicon single crystals," Journal of Applied Physics70, 758-771 (1991).

Professional Activities and Honors

Fellow, American Association for Advancement of Science (AAAS), 2011

Fellow, American Society of Mechanical Engineers (ASME), 2009

Board Member, Science Tech Adv Board, Tsinghua-Tel Aviv Univ XIN Center, 2014-

Board Member, Board of Trustees, UIUC Confucius Institute, 2014 –

Advisory Board, Acta Mechanica Solida Sinica (AMSS), 2008 –

Co-Editor-in-Chief, Extreme Mechanics Letters, Elsevier, 2014 -

Guest Editor, Materials Science and Engineering A, 2005

Editorial Board, International Journal of Mechanics and Solids, 2004-

Engineering Council Award for Excellence in Advising, UIUC, 2002, 2004

Guest Editor Materials Science and Engineering A, 1999-2000

Japan Society for the Promotion of Science Fellowship, Japan, 1999

Principal Organizer, a symposium at TMS Annual Meeting, 1999

Max-Planck Society Fellowship, Germany, 1998

NSF Research Initiation Award, 1992

Tau Beta Pi (Engineering Honor Society)

Society Memberships: AAAS, ASME, BMES, TMS, MRS, American Academy of Mechanics